20 layers OEM circuit board design PCB surface mount fabrication

20 layers OEM circuit board design PCB surface mount fabrication

● 4 YAMAHA High-speed SMT Lines

● 6 million daily SMT placements capability

● 400,000 daily DIP placements capability

● 500×600 mm Maximum Board Size 

● 0.25"x 0.25" Minimum Board Size 

● 450 mm Max. Width for Wave-Solder

● Passives Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement

SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function Test/Burn-in/Finished products assembly 


Details

High Frequency PCB Prototype

High Frequency PCB Prototype

High Frequency PCB Prototype

High Frequency PCB Prototype

High Frequency PCB Prototype


PCB processing capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Thickness0.1-5.0mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin


PCB ASSEMBLY CAPABILITY

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component1005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting
accuracy(100FP)
Whole assembly accuracy up to ±50 micron,whole
process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day