Service and Support

Process Capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper - base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, immersion tin, osp, gold osp, electrospray tin

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component01005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting accuracy(100FP)Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day

What We Do

PCB production, PCBA production, components purchasing, testing, finished products assembly, aging test, packaging.

Production Service

  • Low threshold

    1 sample order acceptable, support bulk components process

  • Low costs

    Our own factory to control the cost of the whole process, only earn processing fees

  • Fast delivery time

    High production capacity, can support rapid delivery, the fastest sample time could be 24 hours

  • More convenient

    Our own PCB factory and PCBA factory, can do material purchasing, finished product assembly, aging test. Solve all of your troubles of production

  • More assured

    We passed ISO9001, UL, TS16949, ROHS and other certifications to make production and products more safer