Professional Customized 3oz~6oz heavy copper Multilayer PCB board fabrication

Professional Customized 3oz~6oz heavy copper Multilayer PCB board fabrication

Place of Origin:  Guangdong, China (Mainland)

Brand Name: HKCT TECH OEM PCB

Model Number: FR-4 TG130/150/170 multi pcb

Base Material: Fr-4 TG130/150/170

Copper Thickness: 1oz-2oz

Board Thickness: 7mm

Min. Hole Size: 0.15mm, 0.20mm

Surface Finishing: HASL,LEAD FREE HASL,OSP

Product name: Factory price high TG Fr4 Metal Alu Small Printed Circuit Board

PCB type: Electronics Manufacturing

Number of Layer: Double Layer PCB,Multilayer PCB

Certification of quantum board led: ISO,SGS,ISO,ROHS

Testing service: Omron AOI/X-Ray/ICT/Solder Paste Testing/Function Testing

Service: PCBA,PCB&PCBA Design&Clone&Production

Application: Consumer Electronics,Industrial,Electronical Products,Battery Pack

PCB Assembly service: SMT THT DIP

Details

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply


PCB fabrication FAQ:

How to avoid BGA solder voids happen?

BGA solder voids may cause the dysfunction of main chip, and may not be found in the test. The hidden risk is high. So now many pcb assembly factories will check it by X-RAY machine.

This type of defect may occur due to residual liquid or impurities in the PCB hole get vaporization after high temperature, or poor laser hole on the BGA pad. Therefore, many HDI boards require plating holes or semi-filled holes to avoid this problem.


PCB processing capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Thickness0.1-5.0mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin


PCB ASSEMBLY CAPABILITY

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component1005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting
accuracy(100FP)
Whole assembly accuracy up to ±50 micron,whole
process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day