HDI PCB Board BGA ENIG Surface Treatment Printed Circuit Board

HDI PCB Board BGA ENIG Surface Treatment Printed Circuit Board

Brand Name: HK CT TECH OEM PCB

Model Number: Double sided, Multilayer pcb

Base Material: FR4, Rogers, Aluminum

Copper Thickness: 0.1oz-8oz

Board Thickness: 0.2mm-4mm

Min. Hole Size: 0.1mm-1mm

Surface Finishing: HASL,LEAD FREE HASL,OSP

Product name: Shenzhen prototype design service pcb circuit boards

PCB type :Customized Electronics Manufacturing

Optional laminate 

Material: Alu/Aluminum,FR4/FR-4,Copper,Ceramic,Rogers

Solder mask color: Blue,Red,Purple,Yellow,White,Green,Black

Number of Layer: 2 layer,8 layer,multi-layer PCBB

Certification of quantum board led: ISO/UL/TS16949/RoHS/TS16949

PCB Standards: IPC-A-610 D/IPC-III Standard

Service: PCBA,PCB&PCBA Design&Clone&Production

Application: Consumer Electronics,Industrial,Electronical Products,Battery Pack

PCB Assembly service: SMT THT DIP

Details

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply

Electronics black FR4 4 layer 2oz finish copper circuit pcb for power supply


PCB processing capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Thickness0.1-5.0mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin


PCB ASSEMBLY CAPABILITY

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component1005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting
accuracy(100FP)
Whole assembly accuracy up to ±50 micron,whole
process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day