China shenzhen electronics 8 layer blue plated board PCB

China shenzhen electronics 8 layer blue plated board PCB

1) Application: Medical device

2) Base Material: FR4

3) Copper Thickness: 35um

4) Board Thickness: 1.8mm

5) Min. Hole Size: 0.2mm

6) Min. Line Width: 0.1mm

7) Min. Line Spacing: 0.1mm

8) Surface Finishing: lead free hasl

9) Solder mask: Blue

10) Board Thickness Tolerance: ±10%

11) Service: PCB&PCBA

13) E-test: 100%


All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.

Details

China shenzhen electronics 8 layer blue plated board PCB

China shenzhen electronics 8 layer blue plated board PCB

China shenzhen electronics 8 layer blue plated board PCB

China shenzhen electronics 8 layer blue plated board PCB

China shenzhen electronics 8 layer blue plated board PCB


PCB processing capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Thickness0.1-5.0mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin


PCB ASSEMBLY CAPABILITY

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component1005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting
accuracy(100FP)
Whole assembly accuracy up to ±50 micron,whole
process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day