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[PCB for sale]What are the four types of chip - mount inductors?

May. 23, 2019

What are the four types of chip - mount inductors?

According to the PCB surface mount fabrication, there are four types of chip inductors, including winding type, laminated type, braided type and thin-film type.  SMT PCBA processing plant  talk about what are the following four types?

The former is the miniaturization product of the traditional winding inductor. The latter is made by multi-layer printing technology and lamination production process, the volume is smaller than the winding type chip inductor, and it is the key product developed in the field of inductor components.

(1) wind type. It is characterized by a wide range of inductance, high precision, small loss, large allowable current, strong inheritance of the production process, simple, low cost, but the deficiency is limited in the further miniaturization. Ceramic core wound inductor can maintain stable inductance and low loss at high frequency.

PCB surface mount fabrication

(2) laminated type. It has good magnetic shielding, high sintering density and good mechanical strength. The disadvantages are low pass rate, high cost, small inductance and large loss.

Compared with wound inductor, it has many advantages. Magnetic circuit closed, will not interfere with the surrounding components, nor by adjacent components interference, conducive to high-density components installation; Integrated structure, high reliability; Good heat resistance and weldability; Regular shape, suitable for automatic surface installation and production.

(3) knitting. It features that the inductance per unit volume below 1MHz is larger and smaller than other chip inductors, which is easy to be installed on the substrate and can be used as a miniature magnetic component for power processing.

(4) thin-film type. It has the characteristics of low loss, high precision, high stability and small volume in microwave frequency band. The internal electrode is concentrated in the same layer, and the magnetic field distribution is concentrated, which can ensure that the component parameters change little after mounting, and the device presents good frequency characteristics above 100MHz.