Brand Name: HK CT TECH
Model Number: OEM PCB design
Base Material: fr-4 flex-rigid pcb board, Fr-4,ALu,Roger,leadfree
Copper Thickness: 1oz
Board Thickness: 1.6mm
Surface Finishing: imersion gold
Product name: HK CTT Quick Prototype Power Printed Circuit Board
Function: PCBA Board Service Prototype PCB Assembly
surface finishing: imersion gold/tin/Au/silver/tin,Osp,Hasl
Application: Consumer Electronics
Solder mask color: Green\White\Red\Blue\Black
PCBA type: Electronics Manufacturing board
Layer: 1-48 Layers (include Rigid-Flex PCB)
Analysis of some phenomenon in PCB fabrication:
Issue:
There is too much residue on the PCB board surface after soldering, and the board is dirty.
Result analysis:
(1) The temperature is not preheated before welding or the preheating temperature is too low, and the temperature of the tin furnace is not enough;
(2) The speed of the board passing is too fast;
(3) Antioxidant and anti-oxidation oil are added to the tin liquid;
(4) too much flux coating;
(5) The component feet and the orifice plate are not proportional (the holes are too large), so that the flux is accumulated;
(6) During the use of the flux, no diluent is added for a long time.
PCB processing capability
| PCB service | Process capability |
| Layer | 1-20 layers |
| Maximum size | ≤600*500mm |
| Thickness | 0.1-5.0mm |
| Wire copper foil thickness | 17-343um（10oz） |
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） |
| Minimum aperture | 0.15mm（6mil） |
| Minimum welding pad | 0.2mm（8mil） |
| Impedance control | +/-10% |
| Shape processing accuracy | +/-0.10mm（4mil） |
| Board type | FR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite |
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin |
PCB ASSEMBLY CAPABILITY
| SMT service | Process capability |
| Processing type | SMT, DIP, After welding, test |
| Maximum board | L50×W50mm～L510×W460mm |
| Maximum thickness | 3mm |
| Minimum thickness | 0.5mm |
| Minimum component | 1005 |
| Maximum component size | 150mm*150mm |
| Minimum pin component spacing | 0.3mm |
| Minimum bga spacing | 0.3mm |
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. |
| SMT capacity | 4 million pins / day |
| DIP capacity | 100 thousand/ day |
