one stop turnkey pcb service, industry control pcb board expert

one stop turnkey pcb service, industry control pcb board expert

Brand Name: OEM pcb design

Model Number: OEM

Base Material: FR4

Copper Thickness: 1/3oz-12oz

Board Thickness: 0.15-4.5mm

Min. Hole Size: 0.1mm

Min. Line Width: 3.5mil

Min. Line Spacing: 3.5mil

Surface Finishing: ENIG,HAL LF,OSP, Immersion Ag

Layer: 1-48 layer

Solder mask color: Green,Red, Black, Yellow, Blue,white

Max Board Size: 610X915mm

Min board size: 10x10mm

Certificate: ISO9001/Iso14001/CE/ROHS

Usage: OEM Electronics

Testing Service: 100% E-testing

Standard: IPC class II-III

Details

Medical PCB 4 layers with good price high quality

Medical PCB 4 layers with good price high quality

Medical PCB 4 layers with good price high quality

Medical PCB 4 layers with good price high quality


Analysis of some phenomenon in PCB fabrication:

Issue: virtual welding, continuous welding, leakage welding

Result analysis:

(1) The amount of flux coating is too small or uneven;

(2) Some of the pads or solder fillets are heavily oxidized;

(3) The PCB design is unreasonable;

(4) The clogged foaming tube and the uneven foaming cause the uneven flux coating .

(5) The operation method is improper when hand immerse tin;

(6) The inclination of the chain is unreasonable;


PCB processing capability

PCB serviceProcess capability
Layer1-20 layers
Maximum size≤600*500mm
Thickness0.1-5.0mm
Wire copper foil thickness17-343um(10oz)
Minimum linewidth / line distance0.075/0.065mm(3mil/2.8mil)
Minimum aperture0.15mm(6mil)
Minimum welding pad0.2mm(8mil)
Impedance control+/-10%
Shape processing accuracy+/-0.10mm(4mil)
Board typeFR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite
Surface treatmentTin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin


PCB ASSEMBLY CAPABILITY

SMT serviceProcess capability
Processing typeSMT, DIP, After welding, test
Maximum boardL50×W50mm~L510×W460mm
Maximum thickness3mm
Minimum thickness0.5mm
Minimum component1005
Maximum component size150mm*150mm
Minimum pin component spacing0.3mm
Minimum bga spacing0.3mm
Maximum component mounting
accuracy(100FP)
Whole assembly accuracy up to ±50 micron,whole
process repetition accuracy ±30 micron.
SMT capacity4 million pins / day
DIP capacity100 thousand/ day