Place of Origin: Shenzhen, China
Number of Layers: 12-Layer
Base Material: FR4
Copper Thickness: 1oz
Board Thickness: 1.6mm
Min. Hole Size: 0.2mm
Min. Line Width: 3mil/4mil
Min. Line Spacing: 3mil/4mil
Surface Finishing: Hasl lead-free, Enig
Solder Mask: Green
Test: Test-rig/Fly Probe Test
Application: Electronic Devices
