Mar. 26, 2019
Basic process flow of SMT processing plant
With the development of PCBA electronic products towards miniaturization and high assembly density, electronic assembly technology is also dominated by surface SMT mounting technology. However, in some PCB boards,supplied from Custom PCB Manufacturer, there are still a certain number of through-hole cartridge components. Plug-in components and surface assembly components and some of the assembly called mixed assembly, referred to as mixed assembly, all using surface assembly components of the assembly called full surface mount.
Pcba patch processing
PCBA assembly mode and its process flow mainly depend on the type of assembled components and the setting conditions of assembly. In general, it can be divided into four types: single-side mount technology, single-side mount technology, double-side mount technology and double-side mount technology.
1. Single-side mounting process
Single-sided mounting refers to the assembly of all components on one side of the PCB. Main process flow of single surface mount: printing solder paste patch reflow welding cleaning detection repair.
2. Single-side mixed packing process
Single-side hybrid assembly refers to the process that components from PCBA Manufacturer are both pasted and inserted, and the components are all assembled on one side of PCB.
3. Double-sided mounting process
Double-sided mounting refers to the assembly of components that are all mounted components and distributed on both sides of the PCB. The main process flow of double-sided paste assembly is as follows: surface A printing solder paste patch reflow welding plug-in pin bending flip plate surface B point patch adhesive patch curing flip plate wave soldering cleaning inspection repair.
4. Double-sided mixed packing process
Two-sided hybrid assembly refers to the assembly of components that are mounted on both sides of the PCB. The main process flow of double-sided mixed packaging is as follows: A surface printing solder paste patch reflow welding plug-in pin bending flip plate B surface point patch adhesive patch curing flip plate wave soldering cleaning inspection repair.